at last, the model of defect size distribution and the model of soft and hard faults caused by defects is given . electromigration effect is still a dominating failure mechanism of interconnect for deep submicron and ultra-deep submicron scale 然后從實際芯片的缺陷類型中抽象出了丟失物缺陷、冗余物缺陷以及介質(zhì)針孔缺陷的幾何模型,給出了缺陷的粒徑分布模型和由缺陷引起的軟故障和硬故障的模型。